The User track aims to bring to the conference real world experience of designing & development of complex embedded Systems as well as VLSI chip design. The goal of this track is to provide a platform for the design & developer community to present and discuss practical aspects of all stages of VLSI design & embedded product development life cycle using actual implementations as examples. The papers presented at this track should help designers gain insight into tricks and techniques that can be readily adopted to enhance or simplify design, development & verification processes.

To this end, we invite proposals for presentations for the User/Designer Track to both, share your knowledge and experience, and participate in the exchange of ideas in the development community. The accepted proposals only need a lecture or a poster presentation at the conference, and do not require a completed paper to appear in the conference proceedings.


Proposals are invited on topics in the following areas but not limited to:

Embedded Systems
1. Systems Engineering
2. Electronic/Circuit Design
3. Hardware-Software co design
4. Software architecture, design & development
5. Real time operating systems
6. Model based software development
7. Hardware software validation & verification
8. Test infrastructure & methodologies
9. Embedded Security
10. Fail safe design
11. Prognostics & Diagnostics
12. IoT
13. Artificial Intelligence
14. Electrification
15. Wireless & Connectivity
16. Multi core & parallel computing

VLSI Front End Design:
1. RTL Design & Synthesis, Low Power Design, Power/Area/Performance Trade-offs
2. Mixed-Signal and RF Design
3. Architectural exploration & optimization (ESL or TLM)
4. Embedded Hardware-Software Co-Design
5. Design and Verification of IPs
6. Various aspects of Verification (Assertion, Coverage, HVL Testbenches)
7. Design Methodologies and Tool Flows
8. Design for Test

VLSI Back End Design:
1. Physical Design Closure
2. Timing Analysis and Optimization
3. Floor Planning and Physical Synthesis
4. Reliability, Design For Manufacturing (DFM)
5. Silicon Debug and Manufacturing Test
6. Multi-chip Modules
7. Package Design


Please submit your proposal in power point format with no more than 10 slides with following details:
1. A Title
2. Name, affiliation, phone number and email addresses along with a short biographical sketch and expertise for all authors
3. An introduction on the practical aspect of the contribution
4. A summary that highlights the specific contribution (practical aspects of the problem, techniques that work and do not work)
5. References, if appropriate

For additional details, please contact :

Submission deadline : July 30, 2017 August 31, 2017   September 30, 2017 ( Firm deadline, will not be extended )

Submit your User/Designer Proposal at Submission Link

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